Temperature control device and temperature control method

ABSTRACT

Pressing an electronic device ( 2 ) to be tested to contact terminals ( 132   a  and  132   b ) while bringing a heater ( 112 ) having equal or close temperature change characteristics to those of the electronic device to be tested by a test pattern, transmitting a test pattern to the electronic device to be tested in this state, and controlling a power consumption of a heater so that total power of a power consumption of the electronic device to be tested by the test pattern and a power consumption of the heater becomes a constant value.

This application is a Divisional of co-pending application Ser. No.10/568,623, filed on Feb. 16, 2006, the entire contents of which arehereby incorporated by reference and for which priority is claimed under35 U.S.C. § 120. application Ser. No. 10/568,623 is the national phaseof PCT International Application No. PCT/JP2004/011843 filed on Aug. 18,2004 under 35 U.S.C. § 371. The entire contents of each of theabove-identified applications are hereby incorporated by reference. Thisnonprovisional application also claims priority under 35 U.S.C. § 119(a)on patent application No. 2003-294615 filed in Japan on Aug. 18, 2003,the entirety of which is herein incorporated by reference.

TECHNICAL FIELD

The present invention relates to a temperature control device and atemperature control method preferably used in an electronic devicetesting apparatus for testing a variety of electronic devices, such as asemiconductor integrated circuit element, (hereinafter, referred torepresentatively as an IC chip), and particularly relates to atemperature control device and a temperature control method capable ofconducting a test at an accurate targeted temperature even in the casewhere self-heating of the electronic device arises due to a pattern oftest signal (hereinafter, referred to as a test pattern) at testing.

BACKGROUND ART

In a production procedure of a semiconductor device, a testing apparatusfor conducting a test on a finally produced IC chip or other electronicdevice is necessary. As one kind of such testing apparatuses, there isknown an electronic device testing apparatus for conducting a test on anIC chip under a normal temperature, a higher temperature condition or alower temperature condition than the normal temperature. It is because,as characteristics of an IC chip, it is required to guarantee to operatewell at a normal temperature, a high temperature and a low temperature.

In an electronic device testing apparatus of this kind, the testingenvironment is brought to be a constant temperature environment at anormal temperature, high temperature or low temperature, then, IC chipsare conveyed to above a test head, where the IC chips are tested bybeing pressed against contact terminals of the test head and brought toelectrically contact with them. From the test as above, the IC chips arepreferably tested and classified to at least good ones and defectiveones.

However, as IC chips become higher at speed and more highly integratedin recent years, self-heating value at operation tends to increase, andsuch a self-heating value tends to increase also during the test. Forexample, there are IC chips generating tens of watts of self-heatingdepending on the kind, so that a temperature range is remarkably widebetween the case without self-heating and the case with self-heating.

Therefore, when conducting a high temperature test, for example, at 150°C. or so, heat due to self-heating generated by IC chips is added tothis heat quantity and a correct test evaluation becomes difficult inspite of conducting test under a constant temperature environment.

A method of providing a sensor for detecting a temperature of IC chipsimmediately close to the IC chips and feeding-back an actual temperatureof the IC chips detected by the sensor to a temperature applying devicehas been proposed (the patent article 1). However, there is a limit eventhough providing a temperature sensor immediately close to IC chips andheat resistance between the IC chips and the temperature sensor cannotbecome zero. Accordingly, a true temperature of the IC chips cannot bedetected as far as using an external sensor.

Also, as a technique for maintaining an IC chip temperature whichchanges momentarily by self-heating to be in a test temperature range,there is a proposal of bringing a temperature control device providedwith a heating function and a cooling function to contact with an ICchip (the patent article 1). However, a heat capacity of IC chips indownsizing trends and a heat capacity of the temperature control devicewere too far different, so that there was a problem that even thefeedback control by a temperature control device cannot follow atemperature change by self-heating of IC chips.

[Patent Article 1] The U.S. Patent Publication No. 6,476,627

DISCLOSURE OF THE INVENTION

The present invention has as an object to provide a temperature controldevice a temperature control method, an electronic device testinghandler, an electronic device testing apparatus and an electronic devicetesting method, by which tests can be conducted at an accurate targetedtemperature even when self-heating of electronic devices arise due to atest pattern at testing and a temperature of the electronic deviceslargely changes.

(1) To attain the above object, according to a first aspect of thepresent invention, there is provided a temperature control device usedfor an electronic device testing apparatus for conducting a test on anelectronic device to be tested by sending a test pattern to theelectronic device to be tested and detecting a response pattern thereto,comprising:

-   -   a temperature adjusting device provided to contact with the        electronic device to be tested; and    -   a power control means for controlling power consumption of the        temperature adjusting device, so that total power of a power        consumption of the electronic device by the test pattern and a        power consumption of the temperature adjusting device becomes a        constant value.

To attain the above object, according to a second aspect of the presentinvention, there is provided a temperature control method for conductinga test on an electronic device to be tested by transmitting a testpattern to the electronic device to be tested and detecting a responsepattern thereto, comprising the steps of:

-   -   bringing a temperature adjusting device to the electronic device        to be tested; and    -   controlling a power consumption of the temperature adjusting        device, so that a total power of a power consumption of the        electronic device to be tested and a power consumption of the        temperature adjusting device becomes a constant value.

To attain the above object, according to a third aspect of the presentinvention, there is provided an electronic device testing handler,comprising:

-   -   a pusher for pressing an electronic device to be tested against        a contact terminal, to which a test pattern is input; and    -   a temperature adjusting device provided to the pusher so as to        contact with the electronic device to be tested;    -   wherein a power consumption of the temperature adjusting device        is controlled, so that total power of a power consumption of the        electronic device to be tested by the test pattern and a power        consumption of the temperature adjusting device becomes a        constant value.

To attain the above object, according to a fourth aspect of the presentinvention, there is provided an electronic device testing apparatus,comprising:

-   -   a test pattern generation means for generating a predetermined        test pattern;    -   a test pattern transmission means for transmitting a test        pattern generated by the test pattern generation means to a        contact terminal, against which a terminal of an electronic        device to be tested is pressed;    -   a determination means for evaluating the electronic device to be        tested based on a response pattern to the test pattern; and    -   a power control means for controlling a power consumption of the        temperature adjusting device, so that total power of a power        consumption of the electronic device to be tested by the test        pattern and a power consumption of a temperature adjusting        device provided for contacting with the electronic device to be        tested becomes a constant value.

To attain the above object, according to a fifth aspect of the presentinvention, there is provided an electronic device testing method forconducting a test on an electronic device to be tested by transmitting apredetermined test pattern to the electronic device to be tested via acontact terminal and detecting a response pattern thereto in a state ofpressing a terminal of the electronic device to the contact terminal,comprising the steps of:

-   -   bringing a temperature adjusting device contact with the        electronic device to be tested;    -   controlling a power consumption of the temperature adjusting        device, so that total power of a power consumption of the        electronic device to be tested by the test pattern and a power        consumption of the temperature adjusting device becomes a        constant value; and    -   evaluating the electronic device to be tested based on a        response pattern to the test pattern.

In the above inventions, the power control means comprises a powerconsumption pattern prediction portion for predicting a powerconsumption pattern in the electronic device to be tested from a testpattern transmitted to the electronic device to be tested; a powerconsumption canceling pattern generation portion for generating a powerconsumption canceling pattern for canceling a power consumption patternin the electronic device to be tested; and a power consumption cancelingpattern transmission portion for transmitting the power consumptioncanceling pattern to the temperature adjusting device.

Alternately, the power control means comprises a first power supplymeans which is one of parallel lines branched from a constant currentsupply means for supplying a constant current, for supplying a currentto the electronic device to be tested; and a second power supply meanswhich is the other parallel line branched from the constant currentsupply means, for supplying a current to the temperature adjustingdevice.

In the above invention, the step for controlling the power consumptioncomprises steps of predicting a power consumption pattern in theelectronic device to be tested from a test pattern transmitted to theelectronic device to be tested; generating a power consumption cancelingpattern for canceling a power consumption in the electronic device to betested; and transmitting the power consumption canceling pattern to thetemperature adjusting device.

Alternately, the step for controlling the power consumption comprisesthe steps of supplying a current to the electronic device to be testedby branching to one of parallel lines from a constant current supplymeans for supplying a constant current; and supplying a current to thetemperature adjusting device by branching to the other parallel linefrom the constant current supply means.

In the temperature control device, temperature control method,electronic device testing handler, electronic device testing apparatusand an electronic device testing method of the present invention, whenconducting a test on the electronic device to be tested by transmittinga test pattern to the electronic device to be tested and detecting aresponse pattern thereto, a power consumption of a temperature adjustingdevice is controlled, so that total power of a power consumption of theelectronic device to be tested by the test pattern and the powerconsumption of the temperature adjusting device becomes a constantvalue.

Namely, even when a test pattern is input, a sum of a power consumptionof electronic devices to be tested and a power consumption of atemperature adjusting device is controlled to be constant, so that abalance of a heat quantity becomes zero when considering that theelectronic devices to be tested and the temperature adjusting device arein one heating system. As a result, even when a temperature of theelectronic devices to be tested changes by inputting a test pattern,heat by the temperature change is cancelled out by the temperatureadjusting device, so that a temperature of the electronic devices to betested can be maintained constant.

Also, by predicting a power consumption pattern of electronic devices tobe tested from a test pattern transmitted to the electronic devices tobe tested, generating a power consumption canceling pattern forcanceling it and sending the same to the temperature adjusting device,and attaining a circuit configuration that a sum of power to be suppliedto the electronic devices to be tested and power to be supplied to thetemperature adjusting device always becomes constant; the temperaturechange can be suppressed without providing a sensor for detecting anactual temperature of the electronic devices to be tested. Particularly,since it is possible to prevent arising of a temperature error of theelectronic devices to be tested due to provision of the temperaturesensor and a control delay due to feedback control, the electronicdevices to be tested can be managed to be kept in a narrower temperaturerange.

Furthermore, as a result of using a temperature adjusting device havingtemperature change characteristics equal to or close to temperaturechange characteristics by power consumption of the electronic devices tobe tested, a correlation or a common point arises between thetemperature change characteristics of the two, so that an operation ofgenerating a power consumption canceling pattern to be sent to thetemperature adjusting device becomes easy. Also, by approximating thetemperature change characteristics, response at the time of controllinga temperature of the temperature adjusting device improves, andapplication of a heat quantity is immediately performed to theelectronic devices to be tested in response to a control instructionvalue. Accordingly, even when an abrupt temperature change arises in theelectronic device to be tested, it is possible to respond to itpromptly, consequently, a test and evaluation can be made under moreaccurate temperature environment.

(2) To attain the above object, according to a sixth aspect of thepresent invention, there is provided a temperature control device usedin an electronic device testing apparatus for conducting a test on anelectronic device to be tested by transmitting a test pattern to theelectronic device to be tested and detecting a response pattern thereto,comprising:

-   -   a heater for dynamically heating the electronic device to be        tested;    -   a cooler made by a peltiert element for cooling or heating the        electronic device to be tested; and    -   a heat sink connected thermally to the cooler, for cooling or        heating a heat release surface of the cooler.

To attain the above object, according to a seventh aspect of the presentinvention, there is provided an electronic device testing apparatus forconducting a test on an electronic device by transmitting a test patternto the electronic device to be tested and detecting a response patternthereto, comprising:

-   -   a temperature control device as explained above;    -   a pusher for pressing an electronic device to be tested against        a contact terminal, to which a test pattern is input; and    -   a cooler made by a peltiert element provided to the pusher so as        to dynamically contact with the electronic device to be tested,        for cooling or heating the electronic device to be tested.

In the above invention, heating power of the heater can be controlleddynamically based on a power consumption of an electronic device to betested by a test pattern.

Also, in the above invention, by generating a power consumptioncanceling pattern based on a signal from a temperature sensing elementprovided to the electronic device to be tested, heating power of theheater can be dynamically controlled.

Also, in the above invention, cooling or heating of the cooler can becontrolled based on a signal from a temperature sensing element providedto the electronic device to be tested.

Also, in the above invention, a first control means for performingfeedback control on cooling power of the cooler based on a signal from atemperature sensing element provided to the electronic device to betested; and a second control means for performing feedforward control onheating power of the heater based on a power consumption of theelectronic device to be tested by the test pattern may be provided.

In the temperature control device and the electronic device testingapparatus of the present invention, a signal from a temperature sensingelement, such as a thermal diode incorporated in an electronic device tobe tested, is retrieved and cooling power of the cooler is controlledbased on the temperature, so that a test can be conducted based on atemperature infinitely close to the test temperature (a junctiontemperature of the IC device) without being affected by changes, such asheat resistance of a part contacting with the electronic device to betested, therefore, reliability of the test result becomes remarkablyhigh.

Furthermore, since a peltiert element is used for the cooler, theresponse is good comparing with a cooler using a coolant, control of thecooling power is easy and dynamic control of the coolant is unnecessary.Also, in the case of excessive cooling, it can be heated only byinverting the applying pole and it is possible to use it also as aheater.

Also, heating power by the heater for the electronic device iscontrolled by feedforward control by predicting a power consumption ofthe electronic device to be tested by the test pattern, so that total ofa heating value of the electronic device and a heating value of theheater can be always maintained to be constant, therefore, control delaydue to feedback control can be prevented and the electronic device canbe managed to be kept in a narrower temperature range.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a block diagram showing an electronic device testing apparatusaccording to an embodiment of the present invention.

FIG. 2 shows graphs of (A) a power consumption pattern of electronicdevices to be tested, (B) temperature change characteristics ofelectronic devices to be tested, (C) power consumption cancelingpattern, (D) temperature change characteristics of a temperatureadjusting device, and (E) temperature change characteristics ofelectronic devices to be tested when provided with the temperatureadjusting device.

FIG. 3 is an electric circuit diagram showing a key part of atemperature control device according to another embodiment of thepresent invention.

FIG. 4 is a block diagram showing an electronic device testing apparatusaccording to still another embodiment of the present invention.

FIG. 5 is a block diagram showing an electronic device testing apparatusaccording to still another embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

Below, embodiments of the present invention will be explained based onthe drawings.

First Embodiment

An electronic device testing apparatus 1 according to the presentembodiment is an apparatus for testing whether IC chips 2 operateappropriately in a state that the IC chips 2 are imposed temperaturestress of a high temperature or a low temperature or at a normaltemperature without any temperature stress and classifying the IC chips2 in accordance with the test results. The electronic device testingapparatus 1 shown in FIG. 1 comprises a handler 11 for successivelyconveying IC chips 2 to be tested to contact terminals 132 provided on atest head 13 and classifying the IC chips 2 finished with the test topredetermined trays in accordance with the test result, a tester 12 forsending a predetermined test pattern to test and evaluate the IC chips 2based on a response signal thereto, and a test head 13 having contactterminals 132 and serving as an interface of the handler 11 and thetester 12. The tester 12 and the test head 13 are electrically connectedand the handler 11 and the tester 12 are electrically connected via acable or other signal line.

Note that the contact terminals 132 include contact terminals 132 a forcontacting with drive terminals 21 a of the IC chips 2 and contactterminals 132 b for contacting with input/output terminals 21 b of theIC chips 2, but they are also generally called contact terminals 132.Also, the contact terminals 132 exchange a variety of signals with thetester 12 via sockets and a wiring substrate 131 provided to the testhead 13.

The handler 11 is provided with a conveyor for conveying pre-test ICchips to above the contact terminals 132 of the test head 13, and theconveyor is provided with pushers 111 for picking up by suction IC chips2 and pressing the same against the contact terminals 132. In thepresent invention, configurations of the conveyor and pushers 111 arenot particularly limited, so that illustration of the conveyor isomitted and the pushers 111 are illustrated schematically.

Note that, as to types of the handler, a type for mounting a largenumber of IC chips on a test tray, conveying the same into a constantchamber installed with a test head 13 having contact terminals 132arranged to face them and conducting a test simultaneously on the largenumber of IC chips, and a type for heating a plurality of IC chips inadvance by using a heat plate, picking up by suction a small number ofIC chips from them and conducting tests sequentially may be used in thepresent invention.

The pushers 111 move close to and away from the contact terminals 132 ofthe test head 13 in the illustrated arrowed direction by a not showndrive mechanism, and a heater 112 and a cooler 113 are provided at theirends. Note that positions of the heater 112 and the cooler 113 may beinverted.

The heater 112 according to the present embodiment is set to a heatcapacity equal to or close to that of the IC chips 2. For example, whenthe IC chip 2 is made of an epoxy resin package having a weight of 2 gor so, the heater 112 is also formed by burying a heating element 112 ain an epoxy resin package having a weight of 2 g or so. Note that theheater according to the present invention is not limited to those havinga heat capacity equal to or close thereto, and it may be any as far asit has temperature change characteristics equal to or close to those ofthe IC chips 2 to be tested, so that the material and weight do not haveto be always the same.

Note that a size of the heater 112 does not have to be always same asthat of the IC chip 2 to be tested, but it is preferable to have a sizecapable of contacting allover the main surface of the IC chip 2 to betested, thereby, a heat transfer effect furthermore improves.

The heater 112 according to the present embodiment takes a function ofadjusting the IC chip 2 to a targeted test temperature by contacting theIC chip 2 and corresponds to the temperature adjusting device accordingto the present invention. Note that power to be supplied to the heatingelement 12 a is based on a canceling pattern of a power consumptiongenerated by a later explained power consumption canceling patterngeneration portion 142 and is input via the power consumption cancelingpattern transmission portion 143.

The cooler 113 according to the present embodiment can be formed by amaterial having a larger heat capacity comparing with those of theheater 112 and IC chip 2 and cools the heater 112, for example, bycirculation of a coolant. The cooler 113 is used when the targeted testtemperature is a low temperature or a normal temperature and turned offwhen the test temperature is a high temperature.

The heater 112 and the cooler 113 may be used as below. For example,when assuming that the targeted test temperature is −60° C. on the lowtemperature side, 150° C. on the high temperature side, 20° C. at thenormal temperature, and temperature rising by self-heating by the ICchip 2 is 10° C. at maximum in each test temperature, when conducting alow temperature test of −60° C., the heater 112 is cooled to −70° C. bythe cooler and 10° C. as the difference is adjusted by heating by theheater 112 or self-heating by the IC chip 2. In the same way, whenconducting a normal temperature test at 20° C., the heater 112 is cooledto 10° C. by the cooler 113 a and 10° C. as the difference is adjustedby heating by the heater 112 or self-heating by the IC chip 2.

On the other hand, when conducting a high temperature test at 150° C.,the cooler 113 is turned off, a potential set temperature of the heater112 is set at 140° C., and 10° C. as the difference is adjusted byself-heating by the IC chip 2 or the heater 112. Note that, whenconducting a high temperature test, a second heater having a larger heatcapacity than those of the heater 112 and the IC chip 2 is provided, theheater 112 is heated to 140° C. by the second heater, and 10° C. as thedifference may be adjusted by heating by the heater 112 or self-heatingby the IC chip 2.

Note that a means for conveying IC chips 2 to the contact terminals 132of the test head 13 is not particularly limited and, for example, ameans of forming vacuum suction holes on a lower surface of the heater112 to pick up the IC chips 2 by vacuum suction and a means for loadingthe IC chips 2 on a test tray may be mentioned.

The tester 12 according to the present embodiment comprises a testpattern generation means 121 for generating a predetermined testpattern, and a test pattern transmission means 122 for transmitting tothe contact terminals 132 a test pattern generated by the test patterngeneration means 121 in a state that terminals 21 (drive terminals 21 aand input/output terminals 21 b are generally called terminals 21) ofthe IC chips 2 are pressed against the contact terminals 132.

The test pattern generation means 121 is for generating a test patternto be supplied to the input/output terminals 21 b of the IC chips 2 in astate that a constant voltage +V is applied to the drive terminals 21 aof the IC chips 2, and the test pattern is suitably designed accordingto a test specification.

Furthermore, the tester 12 according to the present embodiment has adetermination means 123 for retrieving a response pattern of the testpattern transmitted from the test pattern transmission means 122 to theinput/output terminals 21 b of the IC chips 2 via the contact terminalsand evaluating the test of the IC chips 2 by comparing with thetransmitted test pattern. The test evaluation result by thedetermination means 123 is transmitted to the handler 11 and post-testIC chips 2 are classified to predetermined trays.

Particularly, the tester 12 of the present embodiment is provided with apower consumption pattern prediction portion 141 for predicting a powerconsumption pattern of the IC chips 2 to be tested by a test pattern, apower consumption canceling pattern generation portion 142 forgenerating a power consumption canceling pattern for canceling the powerconsumption pattern, and a power consumption canceling patterntransmission portion 143 for transmitting the power consumptioncanceling pattern to the heater 112. The power consumption patternprediction portion 141, the power consumption canceling patterngeneration portion 142 and the power consumption canceling patterntransmission portion 143 compose the power control means 14 according tothe present invention.

The power consumption pattern prediction portion 141 predicts from thetest pattern power to be consumed by IC chip 2 when a test patterngenerated by the test pattern generation means 121 of the tester 12 istransmitted to the IC chip 2. Namely, the circuit configuration of theIC chip 2 to be tested is known, it is possible to obtain in advance acurrent to flow into an internal circuit of the IC chip 2 by a logicalsignal input to the input/output terminals 21 b of the IC chip 2. Also,the power consumption pattern to be generated here is obtained as apattern synchronizing in terms of time with the test pattern generatedby the test pattern generation means 121.

The power consumption canceling pattern generation portion 142 generatesa power consumption canceling pattern for canceling the powerconsumption pattern obtained by the power consumption pattern predictionportion 141. The power consumption canceling pattern is generated as apattern synchronizing in terms of time with the power consumptionpattern, so that it also becomes a pattern synchronizing in terms oftime with the test pattern generated by the test pattern generationmeans 121.

As explained above, when a test pattern is input to the IC chip 2, theIC chip 2 starts self-heating due to power consumed by the internalcircuit of the IC chip 2 and causes change of the targeted testtemperature. However, in the present embodiment, by inputting a patternto cancel the power consumption as a main factor of the self-heating isinput to the heating element 112 a of the heater 112, a total of thepower consumption in the IC chip 2 and the power consumption of theheater 112 (heating element 112 a) is maintained to be constant and,thereby, temperature change of the IC chip 2 is suppressed.

Namely, when the test pattern is input to the IC chip 2, as shown inFIG. 2(A), a large and small currents (O, i_(m), i_(max), i_(min)) flowto the internal circuit of the IC chip 2. By flowing the large and smallcurrents, as shown in FIG. 2(B), the IC chip 2 results in self-heatingat a different heat quantity or does not result in self-heating, so thata temperature of the IC chip itself changes. Therefore, the powerconsumption canceling pattern generation portion 142 according to thepresent embodiment determines a power consumption canceling pattern, sothat a total of the power consumption by the IC chip 2 and the powerconsumption of the heater 112 becomes always a constant value. FIG. 2(C)shows an example of a canceling pattern.

Particularly, the heater 112 according to the present embodiment is setto have a heat capacity equal to or close to that of the IC chip 2, sothat a calculation formula for generating a power consumption cancelingpattern from the power consumption pattern of the IC chip 2 becomessimple, and a program creating operation becomes extremely easy.

The power consumption canceling pattern generated by the powerconsumption canceling pattern generation portion 142 as above istransmitted to the power consumption canceling pattern transmissionportion 143 and supplied as power (a current in the case of a constantvoltage) from there to the heating element 112 a of the heater 112. Atemperature of the heater 112 by the power consumption canceling patternchanges as shown in FIG. 2D and, when it is put together withtemperature change of the IC chip 2 shown in FIG. 2(B), a constanttemperature as shown in FIG. 2(E) is attained.

Next, the effect will be explained.

In an example below, the case of conducting a high temperature operationtest at 150° C. on an IC chip 2 according to the present embodiment willbe explained. When assuming that the IC chip 2 causes self-heating of10° C. at maximum when a test pattern is input, a temperature of the ICchip 2 rises by 10° C. at maximum comparing with a temperature T₀ in astate without self-heating as shown in FIG. 2(B), and the change isbetween T₀ to T₀+10° C. during the test. Accordingly, a reference settemperature T₁ (refer to FIG. 2(D)) of the heater 112 is set at 140° C.,which is lower by 10° C. than the targeted test temperature of 150° C.and the remaining 10° C. is changed in response to the test pattern tobe input to the IC chip 2.

To furthermore specifically explain with reference to FIG. 2, theinput/output terminals 21 b of the IC chip 2 receives a predeterminedtest pattern generated by the test pattern generation means 121 in astate that a constant voltage V is applied to the drive terminals 21 aand, thereby, a current shown in FIG. 2(A) flows into the internalcircuit of the IC chip 2. Times 0 to t₁, t₂ to t₃ and t₄ to t₅ are in atest pattern suspended state, time t₁ to t₂ is a test pattern 1 (i_(m)),time t₃ to t₄ is a test pattern 2 (i_(max)), and time t₅ to t₆ is a testpattern 4 (i_(min)), respectively.

As explained above, a current of the IC chip 2 increases or decreasesand a large current i_(max) flows or a small current i_(min) flows evenwhen the current increases, so that a temperature of the IC chip 2itself changes between T₀ to T₀+10° C. as shown in FIG. 2(B) in responseto the power consumption pattern. Particularly, a downsized IC chip 2has a small heat capacity, so that the temperature sensitively changesin response to an increase and decrease of the current.

On the other hand, as a current to be supplied to the heater 112, apotential current i₀ is set, by which a temperature of the heater 112becomes 140° C. being lower than the test temperature of 150° C. by 10°C., and a current based on the power consumption canceling pattern shownin FIG. 2(C) is added thereto.

Namely, as in the times 0 to t₁, t₂ to t₃ and t₄ to t₅ shown in FIG.2(A), when a power consumption of the power consumption pattern issmall, the IC chip 2 causes almost no self-heating, therefore, a currentobtained by adding i′_(max) to the potential current i0 is supplied tothe heater 112 so that the temperature of the heater 112 reaches 150° C.As a result, as shown in FIG. 2(E), the IC chip 2 also becomes 150° C.as the test temperature and a test can be conducted at the targeted testtemperature.

Alternately, when time t1 to t2 shown in FIG. 2(A) is the test pattern 1(im), time t3 to t4 is the test pattern 2 (imax) and time t5 to t6 isthe test pattern 3 (imin), that is, their power consumptions are notzero and the absolute values are different, currents obtained by addingcurrents i′_(m) and i′_(min) according to the respective powerconsumption are added to the potential current i0 are supplied to theheater 112, so that a temperature of the heater 112 reaches 150° C. As aresult, as shown in FIG. 2(E), the IC chip 2 also becomes 150° C. as thetest temperature, and the test can be conducted at the targeted testtemperature.

As explained above, in the electronic device testing apparatus, thetemperature control device and electronic device testing methodaccording to the present embodiment, even when a temperature of the ICchip 2 itself changes by an input of a test pattern, heat by thetemperature change is canceled by the heater 112, so that thetemperature of the IC chip 2 can be maintained to be constant.

Also, a power consumption pattern to be consumed by the IC chip 2 due tothe test pattern transmitted to the IC chip 2 is predicted and a powerconsumption canceling pattern for canceling the same is generated, thetemperature change due to the self-heating can be suppressed withoutproviding a sensor for detecting an actual temperature of the IC chip 2.Particularly, it is possible to prevent a temperature error of the ICchip 2 caused by providing a temperature sensor and a control delay byfeedback control, the IC chip 2 can be managed to be kept in a narrowertemperature range.

Furthermore, since a heater 112 having a heat capacity of equal to orclose to a heat capacity of the IC chip 2 is brought to contact thesame, an operation of generating a power consumption canceling patternis simplified, response at the time of controlling the temperature ofthe heater 112 improves, and application of heat to the IC chip 2 inresponse to a control instruction value can be performed immediately.Accordingly, even when an abrupt temperature change arises on the ICchip 2, it can be handled immediately, consequently, a test andevaluation can be made in correct temperature environment.

Second Embodiment

FIG. 3 is an electric circuit diagram showing a key part of atemperature control device according to another embodiment of thepresent invention. In the above embodiment, the power control means 14was composed of a power consumption prediction portion 141, a powerconsumption canceling pattern generation portion 142, and a powerconsumption canceling pattern transmission portion 143, while in thepresent embodiment, it is composed of a constant current supply circuit144 (corresponding to the constant current supply means according to thepresent invention), a first power supply circuit 145 (corresponding tothe first power supply means according to the present invention) and asecond power supply circuit 146 (corresponding to the second powersupply means according to the present invention).

As shown in FIG. 3, drive terminals 21 a of the IC chip 2 is appliedwith a +V voltage. The application voltage of an application line 152 isconnected to an input terminal of an operational amplifier 151 via asensing line 153 and, due to an input (+V) from the variable powersource 150, an output terminal of the operational amplifier 151 controlsthe drive terminals 21 a via the transistor 154 and the transistor 146a, consequently, a constant voltage V is applied to the drive terminals21 a of the IC chip 2.

The constant current supply circuit 144 according to the presentembodiment is configured by connecting to a power source terminal +VA atransistor 144 a and a resistance 144 b being in parallel with a zenerdiode 144 c and a resistance 144 d, as a result, a constant current i₁flows to a line from the power source terminal +VA to a branch point147.

The branch point 147 of the line supplied with the constant current isconnected to the drive terminals 21 a of the IC chip 2 as explainedabove, and being in parallel therewith, a heater 112 composed of atransistor 146 a and a resistance 112 a is connected. A line from thebranch point 147 to the IC chip 2 composes the first power supplycircuit 145 of the present embodiment, and a line from the branch point147 to the heater 112 composes the second power supply circuit of thepresent embodiment. Note that the transistor 146 a itself may beconfigured as the heater 112 as far as it is a transistor capable offlowing a targeted current.

In the present embodiment, when a test pattern is input to theinput/output terminals 21 b of the IC chip 2, a constant current i₁ issupplied from the power source terminal +VA, and a current i₂ flows fromthe branch point 147 to an internal circuit of the IC chip 2 via thedrive terminals 21 a through the line 152 (via the first power supplycircuit 145), and a remaining current i₃=i₁−i₂ flows from the branchpoint 147 to the resistor 112 a via the transistor 146 a.

Accordingly, a total current value flowing to the IC chip 2 and theheater 112 becomes constant i₁ and, because the application voltage isconstant, the total power consumption also becomes constant. As aresult, total of heat quantity generated by the IC chip 2 and heatquantity generated by the heater 112 always becomes constant.

The electronic device testing apparatus, the temperature control deviceand an electronic device testing method according to the presentembodiment configured as above can also maintain a temperature of the ICchip 2 to be constant even when a temperature of the IC chip 2 itselfchanges due to an input of the test pattern because the heat by thetemperature change is cancelled by the heater 112.

Also, since the circuit is configured that the total power (current i₂)supplied to the IC chip 2 and power (current i₃) supplied to the heater112 always becomes constant i₁, a temperature change due to self-heatingcan be suppressed without providing a sensor for detecting an actualtemperature of the IC chip 2. Particularly, since a temperature error ofthe IC chip 2 due to provision of a temperature sensor and a controldelay due to feedback control can be prevented, the IC chip 2 can bemanaged to be kept in a narrower temperature range.

Furthermore, since the total power consumption by the hardware is madeto be constant comparing with the above embodiment, an operation ofpredicting power consumption of the IC chip 2 based on the test patternbecomes unnecessary, so that it is advantageous particularly when thetest pattern is complicated and when a variety of kinds of test patternshave to be dealt with.

Third Embodiment

FIG. 4 is a block diagram showing an electronic device testing apparatus1 according to still another embodiment of the present invention. Theelectronic device testing apparatus 1 according to the presentembodiment is, as same as that shown in FIG. 1, also an apparatus fortesting whether IC chips 2 operate appropriately in a state of beingimposed a high temperature or low temperature stress or at a normaltemperature without any temperature stress and classifying the IC chips2 according to the test result.

The electronic device testing apparatus 1 shown in FIG. 4 comprises ahandler 11 for successively conveying IC chips 2 to be tested to contactterminals 132 provided on a test head 13 and classifying the IC chips 2finished with test to predetermined trays in accordance with the testresult, a tester 12 for sending a predetermined test pattern to test andevaluate the IC chips 2 based on the response signal, and a test head 13having contact terminals 132 and serving as an interface of the handler11 and the tester 12. The tester 12 and the test head 13 areelectrically connected and the handler 11 and the tester 12 areelectrically connected via a cable or other signal line.

Note that the contact terminals 132 include contact terminals 132 a forcontacting with drive terminals 21 a of the IC chips 2 and contactterminals 132 b for contacting with input/output terminals 21 b of theIC chips 2, and they are also generally called contact terminals 132.Also, the contact terminals 132 exchange a variety of signals with thetester 12 via sockets and a wiring substrate 131 provided to the testhead 13.

The handler 11 is provided with a conveyor for conveying pre-test ICchips to above the contact terminals 132 of the test head 13, and theconveyor is provided with pushers 111 for picking up by suction the ICchips 2 and pressing the same against the contact terminals 132. In thepresent invention, configurations of the conveyor and pushers 111 arenot particularly limited, so that illustration of the conveyor isomitted and the pushers 111 are illustrated schematically.

Note that, as to types of the handler, a type for mounting a largenumber of IC chips on a test tray, conveying the same into a constantchamber installed with a test head 13 having contact terminals 132arranged to face them and conducting a test simultaneously on the largenumber of IC chips, and a type for heating a plurality of IC chips inadvance by using a heat plate, picking up by suction a small number ofIC chips from them and conducting tests sequentially may be used in thepresent invention.

The pushers 111 move close to and away from the contact terminals 132 ofthe test head 13 in the illustrated arrowed direction by a not showndrive mechanism, and a heater 112 and a cooler 113 are provided at theirends. Note that positions of the heater 112 and the cooler 113 may beinverted.

Preferably, the heater 112 according to the present embodiment is set toa heat capacity equal to or close to that of the IC chips 2 and has thesame or similar temperature change characteristics as those of the ICchips 2, but it is not limited to those. Also, as to heat transfercharacteristics of the heating element 112 a, it is configured not totransfer heat directly to the cooler 113 side and, preferably, it isconfigured to heat the IC chips 2 efficiently. For example, it can berealized, for example, by providing a low heat transfer member 112 bhaving a high heat resistance to the upper portion side of the heatingbody 112 a shown in FIG. 4 and by forming a hollow space. Furthermore,to enable dynamic temperature control of the IC chips 2, it ispreferable to form a heating body 112 a and low heat transfer member 112b having a configuration that the heat response time becomes theshortest. A path of a heat source generated by the heating body 112 a isthat the heat transfers to an immediately beneath heat transfer surface,the heat transfers in the crosswise direction while heating the IC chips2 by contacting by the heat transfer surface, and the heat istransferred from a peripheral portion of the heater 112 to the cooler113 side above. Due to the configuration, the IC chip 2 can be a heatingconfiguration capable of heating rapidly.

The heater 112 according to the present embodiment takes a function ofadjusting the IC chip 2 to be a targeted test temperature by contactingthe IC chip 2. Note that power to be supplied to the heating element 112a is based on a canceling pattern of a power consumption generated by alater explained power consumption canceling pattern generation portion142 and input via the power consumption canceling pattern transmissionportion 143, and feedforward control is performed.

The cooler 113 according to the present embodiment is formed by apeltiert element having one main surface as a heat absorbing surface 113a and the other main surface as a heat releasing surface 113 b, and acurrent value supplied from a power source outside of the figure iscontrolled by a control signal from the first control means 155. Also,by switching the current flowing direction, it can be used both forcooling and heating. As a result, a temperature of a coolant flowing inthe heat sink 114 does not have to be dynamically controlled. Also,there is an advantage that a set temperature of the IC chips can berealized relatively easily in a wide range of −60° C. to +150° C.

Note that the peltiert element composing the cooler 113 shown in FIG. 4maintains a temperature of a contact surface of the heater 112 and theIC chips 2, furthermore, a junction temperature Tj of the IC chips 2 tobe a desired temperature by cooling the heater 112 as a result that thelower surface becomes a heat absorbing surface 113 a, while when cooledexcessively, an application pole from the power source out of the figureis inverted to change the lower surface to be a heat releasing surface,so that a temperature decline of the heater 112 can be suppressed.

As to the cooler 113, feedback control is performed based on atemperature from a later explained thermal diode 21 c of the IC chip 2.The heater 112 and the cooler 113 can be used as below. For example,when assuming that the targeted test temperature is −60° C. on the lowtemperature side, 150° C. on the high temperature side, 20° C. at thenormal temperature, and temperature rising by self-heating of the ICchip 2 is 10° C. at maximum in each test temperature; when conducting alow temperature test of −60° C., the heater 112 is cooled to −70° C. bythe cooler and 10° C. as the difference is adjusted by heating by theheater 112 or self-heating by the IC chip 2. In the same way, whenconducting a normal temperature test at 20° C., the heater 112 is cooledto 10° C. by the cooler 113 and 10° C. as the difference is adjusted byheating by the heater 112 or self-heating by the IC chip 2.

On the other hand, when conducting a high temperature test at 150° C.,the cooler 113 is turned off, a potential set temperature of the heater112 is set at 140° C., and 10° C. as the difference is adjusted byself-heating by the IC chip 2 or the heater 112. Note that, whenconducting a high temperature test at 150° C., in the same way as in theabove normal temperature test, the heater 112 is cooled to 140° C. bythe cooler 113, and 10° C. as the difference may be adjusted by heatingby the heater 112 or self-heating by the IC chip 2.

Note that a means for conveying IC chips 2 to the contact terminals 132of the test head 13 is not particularly limited and, for example, ameans of forming vacuum suction holes on a lower surface of the heater112 to pick up the IC chips 2 by vacuum suction and a means for loadingthe IC chips 2 on a test tray may be mentioned.

The tester 12 according to the present embodiment comprises a testpattern generation means 121 for generating a predetermined testpattern, and a test pattern transmission means 122 for transmitting tothe contact terminals 132 a test pattern generated by the test patterngeneration means 121 in a state that terminals 21 (drive terminals 21 aand input/output terminals 21 b are generally called terminals 21) ofthe IC chips 2 are pressed against the contact terminals 132.

The test pattern generation means 121 is for generating a test patternto be supplied to the input/output terminals 21 b of the IC chips 2 in astate that a constant voltage +V is applied to the drive terminals 21 aof the IC chips 2, and the test pattern is suitably designed accordingto a test specification.

Furthermore, the tester 12 according to the present embodiment has adetermination means 123 for retrieving a response pattern of the testpattern transmitted from the test pattern transmission means 122 to theinput/output terminals 21 b of the IC chips 2 via the contact terminalsso as to test and evaluate the IC chips 2 by comparing with thetransmitted test pattern. The test evaluation result by thedetermination means 123 is transmitted to the handler 11 and post-testIC chips 2 are classified to predetermined trays.

Particularly, in the present embodiment, a power consumption patternprediction means 161 for predicting a power consumption pattern of theIC chips 2 to be tested by a test pattern, a power consumption cancelingpattern generation means 162 for generating a power consumptioncanceling pattern for canceling the power consumption pattern, and asecond control means 163 for transmitting the power consumptioncanceling pattern to the heater 112 are provided.

The power consumption pattern prediction means 161 predicts power to beconsumed by IC chip 2 when a test pattern generated by the test patterngeneration means 121 of the tester 12 is transmitted to the IC chip 2based on the test pattern. Namely, the circuit configuration of the ICchip 2 to be tested is known, it is possible to obtain in advance acurrent to flow into an internal circuit of the IC chip 2 by a logicalsignal input to the input/output terminals 21 b of the IC chips 2. Also,the power consumption pattern to be generated here is obtained as apattern synchronizing in terms of time with the test pattern generatedby the test pattern generation means 121.

The power consumption canceling pattern generation means 162 generates apower consumption canceling pattern for canceling the power consumptionpattern obtained by the power consumption pattern prediction means 141.The power consumption canceling pattern is generated as a patternsynchronizing in terms of time with the power consumption pattern, sothat it also becomes a pattern synchronizing in terms of time with thetest pattern generated by the test pattern generation means 121.

As explained above, when a test pattern is input to the IC chip 2, theIC chip 2 starts self-heating due to power consumed by the internalcircuit of the IC chip 2 and causes change of the targeted testtemperature. However, in the present embodiment, by inputting a patternto cancel the power consumption as a main factor of the self-heating isinput to the heating element 112 a of the heater 112, the total of thepower consumption in the IC chip 2 and the power consumption of theheater 112 (heating element 112 a) is maintained to be constant and,thereby, temperature change of the IC chip 2 is suppressed.

This configuration is the same as that in the above explained embodimentand, when the test pattern is input to the IC chip 2, as shown in FIG.2(A), a large and small currents (O, i_(m), i_(max), i_(min)) flow tothe internal circuit of the IC chip 2. By flowing the large and smallcurrents, as shown in FIG. 2(B), the IC chip 2 results in self-heatingat a different heat quantity or does not cause any self-heating, so thata temperature of the IC chip itself changes. Therefore, the powerconsumption canceling pattern generation means 162 according to thepresent embodiment determines a power consumption canceling pattern, sothat a total of the power consumption by the IC chip 2 and the powerconsumption of the heater 112 always becomes a constant value. FIG. 2(C)shows an example of a canceling pattern.

The heater 112 is set to have a heat capacity equal to or close to thatof the IC chip 2 here, so that a calculation formula for generating apower consumption canceling pattern from the power consumption patternof the IC chip 2 can be simple, and a program creating operation becomesextremely easy.

The power consumption canceling pattern generated by the powerconsumption canceling pattern generation means 162 as above istransmitted to the second control means 163 and supplied as power (acurrent in the case of a constant voltage) from there to the heatingelement 112 a of the heater 112. A temperature of the heater 112 by thepower consumption canceling pattern changes as shown in FIG. 2D and,when it is put together with temperature change of the IC chip 2 shownin FIG. 2(B), a constant temperature as shown in FIG. 2(E) is attained.

Note that the heater 112 is provided with a temperature sensor 115, anactual temperature of the heater 112 is transmitted to the secondcontrol means 163, a temperature of a part of the heater 112 ismonitored whether it is at a desired temperature or not and, inaccordance with need, cooling/heating capacity of the cooler 113 orcooling capacity of the coolant temperature adjusting device 114 c iscontrolled. Note that it may be used for detecting excessive heating ofthe heater 112 to prevent it. Also, when an IC chip 2 not provided witha thermal diode 21 c is an electronic device to be tested, a detectionsignal of the temperature sensor 115 is transmitted to the first controlmeans 165 and a temperature of the cooler 113 is controlled based on theactual temperature of the heater 112.

Particularly, the electronic device testing apparatus 1 of the presentembodiment uses a thermal diode 21 c (corresponding to a temperaturesensing element according to the present invention) incorporated in theIC chip 2 to detect an actual temperature, particularly, a junctiontemperature Tj (a temperature at a junction potion of the IC chip) attesting.

For example, since an element like a thermal diode is a temperaturesensing element wherein a signal characteristics with respect to atemperature is determined unambiguously, when reading a response signalby the tester 12, it also retrieves an output signal from theinput/output terminals 12 b (including grounded terminals) electricallyconnected to the thermal diode and, thereby, an actual temperature ofthe IC chip 2 is calculated.

Therefore, an electric signal of the input/output terminals 21 bcorresponding to the thermal diode 21 c is retrieved from the contactterminals 132 of the test head 13 to the Tj temperature calculationmeans 164. The Tj temperature calculation means 164 stores a calculationprogram for calculating an actual temperature from diode characteristicsof the thermal diode 21 c of the IC chip 2, and an actual temperature ofthe IC chip 2 obtained thereby is sent to the first control means 165.

Note that retrieval of an electric signal regarding the thermal diode 21c from the test head 13 to the Tj temperature calculation means 164 isattained by adding a retrieval command of the electric signal of thethermal diode 21 c to the test program set to the tester 12, so that itcan be realized without changing the hardware.

Temperature data input to the first control means 165 is infinitelyclose to the junction temperature of the IC chip 2, so that it isdetermined whether the temperature is in a temperature range as the testcondition or not and, when it is out of the temperature condition, thepeltiert element of the cooler 113 is adjusted (feedback control) tohave an application voltage to make it within the temperature condition.

In the present embodiment, the peltiert element is used in the cooler113, so that a heat sink 114 for discharging heat from the heatreleasing surface 113 b is provided. The heat sink 114 takes in acoolant, such as Flourinert (fluorine inert fluid), from an inlet 114 aand discharges the same from an outlet 114 b and, by circulating thesame by the coolant temperature adjusting device 114 c, the heat sink114 is used as a ground portion in terms of temperature. The temperaturecontrol of the heat sink 114 is attained by feedback control based on atemperature from the thermal diode 21 c sent to the first control means165.

As explained above, in the present embodiment, first, a signal from atemperature sensing element, such as a thermal diode 21 c incorporatedin an IC chip 2, is retrieved and cooling power of the cooler 113 iscontrolled by feedback control based on the temperature, so that a testcan be conducted based on a temperature infinitely close to a testtemperature (a junction temperature Tj of the IC device 2) without beingaffected by changes of thermal resistance of a pressing and contactingpart of the IC chip 2.

Also, since a peltiert element is used in the cooler 113, the responseis superior to that of a cooler using a coolant, and control of thecooling power is also simple. Also, even in the case of excessivecooling, it can be heated only by inverting the application pole, sothat it also serves as a heater 112. Also, since a peltiert element isused in the cooler 113, a coolant temperature of the cooling medium doesnot have to be dynamically controlled.

Also, as to heating power of the IC chip 2 by the heater 112, a powerconsumption of the IC chip 2 is predicted by a test pattern andfeedforward control is performed thereon, so that the total of a heatingvalue of the IC chip 2 and a heating value of the heater 112 can bealways maintained constant and, thereby, a control delay due to feedbackcontrol can be prevented and the IC chip 2 can be managed to be kept ina narrower temperature range.

In the block diagram in FIG. 4 as explained above, the present inventionwas explained by taking a specific example that the first control means165 controls the cooler 113 based on a signal of a temperature detectedby the thermal diode 21 c, but the heating body 112 a side may be alsocontrolled at a time. In that case, due to the heating body 112 a withrapid response characteristics, more preferable temperature controlbecomes possible.

Also, it takes heat transfer delay time of, for example, tens ofmilliseconds or so for a heat source from the heating body 112 a toreach inside of the IC chip 2. Therefore, during the time correspondingto the heat transfer delay time, the test pattern generation means 121may generate a rapid power consumption canceling pattern and supply thesame to the power consumption pattern prediction means 161. As a result,temperature control with furthermore preferable response characteristicsbecomes possible.

Also, in the block diagram in FIG. 4 explained above, it is configuredto be provided with a power consumption pattern prediction means 161 anda power consumption canceling pattern generation means 162, but it maybe configured to omit them as shown in FIG. 5 and a junction temperatureof the IC chip 2 may be detected by the thermal diode 21 c and both ofthe cooler 113 and the heating body 112 a may be controlled at a timebased thereon. Preferably, roles of the two are that the cooler 113handles canceling of gentle temperature change and the heating body 112a handles canceling of abrupt temperature change. In that case, a powerconsumption canceling pattern does not have to be generated.

Also, as another configuration example, means for performingdifferential addition or differential subtraction on a heating powerenergy to be supplied to the heating body 112 a based on a change amountof a temperature change detected by the thermal diode 21 c may be added.For example, the heating power is increased differentially when adecline of the junction temperature is detected, while the heating poweris differentially decreased when a rise of the junction temperature isdetected. Due to this, response characteristics of heat transfer can becorrected, so that temperature control with furthermore preferableresponse characteristics becomes possible.

The embodiments explained above are described to facilitateunderstanding of the present invention and is not to limit the presentinvention. Accordingly, respective elements disclosed in the aboveembodiments include all design modifications and equivalents belongingto the technical scope of the present invention.

1. A temperature control device used for an electronic device testingapparatus for conducting a test on an electronic device to be tested bysending a test pattern to the electronic device to be tested anddetecting a response pattern thereto, comprising: a temperatureadjusting device provided to contact with said electronic device to betested; and a power control means for controlling power consumption ofsaid temperature adjusting device, so that total power of a powerconsumption of said electronic device by said test pattern and a powerconsumption of said temperature adjusting device becomes a constantvalue, wherein said power control means comprises a first power supplymeans which is one of parallel lines branched from a constant currentsupply means for supplying a constant current, for supplying a currentto said electronic device to be tested; and a second power supply meanswhich is the other parallel line branched from said constant currentsupply means, for supplying a current to said temperature adjustingdevice.
 2. A temperature control method for conducting a test on anelectronic device to be tested by transmitting a test pattern to saidelectronic device to be tested and detecting a response pattern thereto,comprising the steps of: bringing a temperature adjusting device to saidelectronic device to be tested; and controlling a power consumption ofsaid temperature adjusting device, so that a total power of a powerconsumption of said electronic device to be tested and a powerconsumption of said temperature adjusting device becomes a constantvalue, wherein said step for controlling the power consumption comprisesthe steps of supplying a current to said electronic device to be testedby branching to one of parallel lines from a constant current supplymeans for supplying a constant current; and supplying a current to saidtemperature adjusting device by branching to the other parallel linefrom said constant current supply means.
 3. An electronic device testingapparatus, comprising: a test pattern generation means for generating apredetermined test pattern; a test pattern transmission means fortransmitting a test pattern generated by said test pattern generationmeans to a contact terminal, against which a terminal of an electronicdevice to be tested is pressed; a determination means for evaluatingsaid electronic device to be tested based on a response pattern to saidtest pattern; and a power control means for controlling a powerconsumption of said temperature adjusting device, so that total power ofa power consumption of said electronic device to be tested by said testpattern and a power consumption of a temperature adjusting deviceprovided for contacting with said electronic device to be tested becomesa constant value, wherein said power control means comprises a firstpower supply means which is one of parallel lines branched from aconstant current supply means for supplying a constant current, forsupplying a current to said electronic device to be tested; and a secondpower supply means which is the other parallel line branched from saidconstant current supply means, for supplying a current to saidtemperature adjusting device.
 4. A temperature control device used in anelectronic device testing apparatus for conducting a test on anelectronic device to be tested by transmitting a test pattern to saidelectronic device to be tested and detecting a response pattern thereto,comprising: a heater for dynamically heating said electronic device tobe tested; a cooler made by a peltiert element for cooling or heatingsaid electronic device to be tested; and a heat sink connected thermallyto said cooler, for cooling or heating a heat release surface of saidcooler.
 5. The temperature control device as set forth in claim 4, fordynamically controlling heating power of said heater based on a powerconsumption of an electronic device to be tested by said test pattern.6. The temperature control device as set forth in claim 4, forgenerating a power consumption canceling pattern based on a signal froma temperature sensing element provided to said electronic device to betested and dynamically controlling heating power of said heater.
 7. Thetemperature control device as set forth in claim 4, for controllingcooling or heating of said cooler based on a signal from a temperaturesensing element provided to said electronic device to be tested.
 8. Thetemperature control device as set forth in claim 4, comprising a firstcontrol means for performing feedback control on cooling power of saidcooler based on a signal from a temperature sensing element provided tosaid electronic device to be tested; and a second control means forperforming feedforward control on heating power of said heater based ona power consumption of the electronic device to be tested by said testpattern.
 9. An electronic device testing apparatus for conducting a teston an electronic device by transmitting a test pattern to saidelectronic device to be tested and detecting a response pattern thereto,comprising: a temperature control device as set forth in claim 4; apusher for pressing an electronic device to be tested against a contactterminal, to which a test pattern is input; and a cooler made by apeltiert element provided to said pusher so as to dynamically contactwith said electronic device to be tested, for cooling or heating saidelectronic device to be tested.
 10. The electronic device testingapparatus as set forth in claim 9, wherein said temperature controldevice generates a power consumption canceling pattern based on a powerconsumption of an electronic device to be tested by said test patternand dynamically controlling heating power of said heater.
 11. Theelectronic device testing apparatus as set forth in claim 9, whereinsaid temperature control device dynamically controls heating power ofsaid heater based on a signal from a temperature sensing elementprovided to said electronic device to be tested.
 12. The electronicdevice testing apparatus as set forth in claim 9, wherein saidtemperature control device controls cooling or heating of said coolerbased on a signal from a temperature sensing element provided to saidelectronic device to be tested.
 13. The electronic device testingapparatus as set forth in claim 9, wherein said temperature controldevice generates a power consumption canceling pattern at a prior stageat predetermined early time based on a power consumption of anelectronic device to be tested by said test pattern and heat transfertime for reaching to inside of said electronic device to be tested anddynamically controls heating power of said heater.
 14. The electronicdevice testing apparatus as set forth in claim 9, wherein saidtemperature control device performs differential addition or subtractionon heating power of said heater based on a temperature change amount ofa signal from a temperature sensing element provided to said electronicdevice to be tested.